KI-FLEX AI chip tapes out with flexible videantis processor platform

December 13, 2022 – videantis GmbH, provider of a unified platform for combined processing of algorithms as diverse as AI (Artificial Intelligence), multi-modal sensor data processing and fusion, or video coding on a single architecture, today announced the tape-out of the FlexAISIC AI chip based on its flexible v-MP6000UDX unified processing platform. The tape-out has been achieved in collaboration with the Fraunhofer Institute for Integrated Circuits IIS, and the chip development is funded by the German Federal Ministry of Education and Research (BMBF) within the KI-FLEX project. KI-FLEX is part of a broader initiative driven by the German BMBF to push research of AI-based technologies for autonomous driving. KI-FLEX develops a powerful and highly energy-efficient hardware platform and the associated software framework for AI-based processing and merging of data from different sensors, resulting in fast and reliable perception and localization for autonomous driving. The videantis v-MP6000UDX platform as the core component of the FlexAISIC is a highly scalable multi-core architecture combined with a tailored bus fabric and multi-banked shared on-chip SRAM which delivers extreme efficiency and performance for a variety of algorithm types like deep learning, computer vision, signal processing, and video coding.