Closer hardware systems bring the future of artificial intelligence into view

IMAGE: Researchers from the Institute of Industrial Science at The University of Tokyo, Kobe Steel, Ltd, and Kobelco Research Institute, Inc, develop high-density, energy-efficient 3D embedded RAM for artificial intelligence applications.... view more Tokyo - Machine learning is the process by which computers adapt their responses without human intervention. This form of artificial intelligence (AI) is now common in everyday tools such as virtual assistants and is being developed for use in areas from medicine to agriculture. A challenge posed by the rapid expansion of machine learning is the high energy demand of the complex computing processes. Researchers from The University of Tokyo have reported the first integration of a mobility-enhanced field-effect transistor (FET) and a ferroelectric capacitor (FE-CAP) to bring the memory system into the proximity of a microprocessor and improve the efficiency of the data-intensive computing system. Their findings were presented at the 2021 Symposium on VLSI Technology.