Answering the need of Higher Performance for Artificial Intelligence Processors Vicor unveils Power-on-Package - ELE Times

Vicor Corporation on August 22, announced the introduction of Power-on-Package modular current multipliers for high performance, high current, CPU/GPU/ASIC ("XPU") processors. By freeing up XPU socket pins and eliminating losses associated with delivery of current from the motherboard to the XPU, Vicor's Power-on-Package solution enables higher current delivery for maximum XPU performance. In response to the ever-increasing demands of high performance applications – artificial intelligence, machine learning, big data mining – XPU operating currents have risen to hundreds of Amperes. Point-of-Load power architectures in which high current power delivery units are placed close to the XPU, mitigate power distribution losses on the motherboard but do nothing to lessen interconnect challenges between the XPU and the motherboard. With increasing XPU currents, the remaining short distance to the XPU – the "last inch" – consisting of motherboard conductors and interconnects within the XPU socket has become a limiting factor in XPU performance and total system efficiency.