GLOBALFOUNDRIES and SiFive to Deliver Next Level of High Bandwidth Memory on 12LP Platform for AI Applications

SANTA CLARA, Calif. and HSINCHU, Taiwan, Nov. 5, 2019 – GLOBALFOUNDRIES (GF) and SiFive, Inc. announced today at GLOBALFOUNDRIES Technology Conference (GTC) in Taiwan that they are working to extend high DRAM performance levels with High Bandwidth Memory (HBM2E) on GF's recently announced 12LP FinFET solution, with 2.5D packaging design services to enable fast time-to-market for Artificial Intelligence (AI) applications. In order to achieve the capacity and bandwidth for data-intensive AI training applications, system designers are challenged with squeezing more bandwidth into a smaller area while maintaining a reasonable power profile. SiFive's customizable high bandwidth memory interface on GF's 12LP platform and 12LP solution will enable easy integration of high bandwidth memory into a single System-on-Chip (SoC) solutions to deliver fast, power-efficient data processing for AI applications in the computing and wired infrastructure markets. As a part of the collaboration, designers will also have access to SiFive's RISC-V IP portfolio and DesignShare IP ecosystem, which will leverage GF's 12LP Design Technology Co-Optimization (DTCO), enabling them to significantly increase silicon specialization, improve design efficiency and deliver differentiated SoC solutions quickly and cost-effectively. "Extending SiFive's reference IP platform, with HBM2E, on GF's best-in-class performance 12LP solution delivers new levels of performance and integration for next generation SoCs and accelerators," said Mohit Gupta, vice president and general manager, IP Business Unit at SiFive.