Smart Vision Chip Fabricated Using Three Dimensional Integration Technology

H.Kurino, M.Nakagawa, K.W.Lee, T.Nakamura, Y.Yamada, K.T.Park and M.Koyanagi Dept. of Machine Intelligence and Systems Engineering, Tohoku University 01, Aza-Aramaki, Aoba-ku, Sendai 980-8579, Japan kurino@sd.mech.tohoku.ac.jp Abstract The smart VISIOn chip has a large potential for application in general purpose high speed image processing systems. In order to fabricate smart vision chips including photo detector compactly, we have proposed the application of three dimensional LSI technology for smart vision chips. Three dimensional technology has great potential to realize new neuromorphic systems inspired by not only the biological function but also the biological structure. In this paper, we describe our three dimensional LSI technology for neuromorphic circuits and the design of smart vision chips. 1 Introduction Recently, the demand for very fast image processing systems with real time operation capability has significantly increased. Conventional image processing systems based on the system level integration of a camera and a digital processor, do not have the potential for application in general purpose consumer electronic products.