Gaps Emerge In Automotive Test

Demands by automakers for zero defects over 18 years are colliding with real-world limitations of testing complex circuitry and interactions, and they are exposing a fundamental disconnect between mechanical and electronic expectations that could be very expensive to fix. This is especially apparent at leading-edge nodes, where much of the logic is being developed for AI systems and image sensing. While existing equipment for wafer, die and package inspection works well enough for most applications all the way down to 7nm, automakers' demands that chips remain functional for 18 years under harsh road conditions is a time-consuming process. So while 99% sampling may be good enough for a smart phone, it is not good enough for safety-critical functions. To make matters worse, automotive testing often requires synchronization between different components, both within and outside of a vehicle, and much more insight into where potential problems can arise. This is no longer just about using an automated test equipment (ATE) machine in a flow to sample a certain percentage of dies and wafers.