Artificial intelligence (AI), digital signal processing (DSP), control and I/O are delivered in a single device, the xcoer.ai, Single device prices for the xcore.ai It can be used by electronics manufacturers to integrate high-performance processing and intelligence economically into products. According to XMOS, xcore.ai is a new generation of embedded platform. It has fast processing and neural network capabilities to enable data to be processed locally and actions taken on-device within nanoseconds. It can interpret data without communication with the cloud and delivers the performance of an applications processor with the ease-of-use of a microcontroller, enabling embedded software engineers to deploy every different class of processing workload on a single multi-core crossover processor, says XMOS.

Start-up Blaize (formerly known as Thinci) has announced details of the first true Graph-Native silicon architecture and software built to process neural networks and enable AI applications. The Blaize Graph Streaming Processor (GSP) architecture enables concurrent execution of multiple neural networks and workflows on a single system. It also supports a range of heterogeneous compute-intensive workloads, says Blaize. According to Blaize, the computing architecture meets the demands and complexity of new computational workloads found in artificial intelligence (AI) applications in automotive, smart vision and enterprise computing segments. The Blaize GSP architecture and Blaize Picasso software development platform blends dynamic data flow methods and graph computing models with fully programmable proprietary SoCs.

The artificial intelligence of things (AIoT) will consist of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices, all of which will require new functionality in terms of size, power consumption, and performance. New microcontrollers are being developed to meet these demands with higher performance and lower power consumption and with new RAM options to improve that of the existing SDRAM and pSRAM available. HyperRAM supports the HyperBus interface and Winbond Electronics offers 32, 64 and 128Mbit devices. Hans Liao, technology manager of DRAMs at Winbond, explained that the computing power, data processing and image display functions of traditional MCUs are limited and that the new IoT devices often have touch panel as image control interface, or require stronger edge computing functions for image processing and speech recognition, requiring higher performance, lower power microcontrollers. Winbond's 64Mbit HyperRAM consumes 90 microW at 1.8V, which is about half of a DRAM of the same capacity, claims the company.