Blog Review: June 24

Cadence's Paul McLellan provides an overview of the new IEEE 1838 standard for manufacturing test of 3D stacked ICs and how it aims to enable testing of multi-die chiplet-based designs. In a video, Mentor's Colin Walls investigates the scope and lifetime of pointers in embedded applications. A Synopsys writer checks out the latest mobile memory standard, JESD209-5A, and the enhancements it contains to the existing LPDDR5 standard, including support for Partial Array Refresh Control, Refresh Management, Enhanced Write Clock Always On Mode, and Optimized Refresh. Rambus' Paul Karazuba takes a look at what makes machine learning models vulnerable to side-channel attacks and why differential power analysis detection and prevention techniques are needed for edge devices. In a blog for Arm, OctoML's Logan Weber and Andrew Reusch explain how optimizing and deploying machine learning workloads to bare-metal devices is becoming easier with Apache TVM and broad framework support, compiler middleware, and flexible autotuning and compilation capabilities.