MediaTek 8K DTV SoC in volume production on TSMC 12FFC technology

The integrated S900 supports features including AI voice-user interface and picture quality enhancements, enabling the next generation of smart TVs to deliver a vastly improved user experience. TSMC's ultra-low power 12FFC process leads the foundry segment's 16/14nm generation technologies in reducing die size and power consumption, which is essential for digital TV applications. It provides a sweet spot between performance and low power that is ideal for enabling voice recognition and edge AI capabilities in consumer electronics, wearables and Internet of Things (IoT) devices. "TSMC has been a key strategic partner of MediaTek for a long time, and their advanced processes have consistently enabled MediaTek's industry-leading designs with innovative features which have satisfied the stringent requirements of our SoC solutions," said HW Kao, corporate VP of MediaTek. "TSMC is pleased to have the opportunity to continue our long history of collaboration and working together on such an innovative product as the S900," said Kevin Zhang, TSMC's VP of business development.