The Future of Semiconductors

Communications of the ACM 

"The advantages that some applications tap into--particularly machine learning and deep learning, which require dense integration of memory and logic--go away." Adding to the challenge: a 3D design increases the risk of failures within the chip. "Producing a chip that functions with 100% integrity is impossible. The system must be fail-tolerant and deal with errors," he adds. Regardless of the approach and the combination of technologies, researchers are ultimately left with no perfect option.

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