Coverage Path Planning of Thermal Interface Materials (TIM) plays a crucial role in the design of power electronics and electronic control units. Up to now, this is done manually by experts or by using optimization approaches with a high computational effort. We propose a novel AI-based approach to generate dispense paths for TIM and similar dispensing applications. It is a drop-in replacement for optimization-based approaches. An Artificial Neural Network (ANN) receives the target cooling area as input and directly outputs the dispense path. Our proposed setup does not require labels and we show its feasibility on multiple target areas. The resulting dispense paths can be directly transferred to automated manufacturing equipment and do not exhibit air entrapments. The approach of using an ANN to predict process parameters for a desired target state in real-time could potentially be transferred to other manufacturing processes.

Thermal management of power electronics and Electronic Control Units is crucial in times of increasing power densities and limited assembly space. Electric and autonomous vehicles are a prominent application field. Thermal Interface Materials are used to transfer heat from a semiconductor to a heatsink. They are applied along a dispense path onto the semiconductor and spread over its entire surface once the heatsink is joined. To plan this application path, design engineers typically perform an iterative trial-and-error procedure of elaborate simulations and manual experiments. We propose a fully automated optimization approach, which clearly outperforms the current manual path planning and respects all relevant manufacturing constraints. An optimum dispense path increases the reliability of the thermal interface and makes the manufacturing more sustainable by reducing material waste. We show results on multiple real products from automotive series production, including an experimental validation on actual series manufacturing equipment.