Huawei has announced two new chips for artificial intelligence applications. The Ascend AI IP and chip series, the world's first AI IP and chip series that natively serves all scenarios, providing optimal TeraOPS per watt. The Ascend series delivers excellent performance per watt in every scenario, whether it's minimum energy consumption or maximum computing power in data centers. Their unified architecture also makes it easy to deploy, migrate, and interconnect AI applications across different scenarios. The Ascend 910 and Ascend 310 chips, which were announced at today's event, mark Huawei's leading AI capabilities at the chip level – the bottom layer of the stack.
Huawei has unveiled its artificial intelligence (AI) strategy and full-stack portfolio, including a series of chips, cloud services, and products. Announced at Huawei Connect 2018 in Shanghai by rotating chair Eric Xu, Huawei's Ascend AI chip series includes the Ascend 910 and Ascend 310, with the company also unveiling the Compute Architecture for Neural Networks (CANN), a chip operators library and automated operators development toolkit, and MindSpore, a device, edge, and cloud training and inference framework. The latter includes "full-pipeline services (ModelArts), hierarchical APIs, and pre-integrated solutions", Huawei said, with the Chinese networking giant to later expand its AI stack to include an AI acceleration card, AI server, AI appliance, and other AI products. "Huawei's AI strategy is to invest in basic research and talent development, build a full-stack, all-scenario AI portfolio, and foster an open global ecosystem," Xu said during his Huawei Connect keynote.
Huawei and Audi have announced that they will partner on intelligent connected vehicles, with the networking giant's Mobile Data Center (MDC) being integrated into the Audi Q7 as a showcase prototype. The MDC would be used in "urban automatic driving environments", Huawei said. "We evaluate a joint development of highly automated driving functions and future oriented vehicle-to-infrastructure communications," EVP of Audi China R&D Saad Metz said at Huawei Connect 2018 in Shanghai on Thursday. "Audi proved in many events over the world to be one of the technology leaders in the area of highly automated [driving]. We are looking forward to intensify the partnership with Huawei in the future, because we are convinced that a closer cooperation between our two companies will bring substantial benefits for both sides."
Huawei has unveiled an AI strategy and a portfolio of supporting products built on two new microchips, which the telecoms giant claims is the world's first AI IP and chip series designed for a full range of deployment scenarios. The Ascend 310 is designed for the low-power computing needs of smart devices and the Ascend 910 for cloud computing. Huawei's rotating chairman Eric Xu said the Ascend 910 has "greatest computing density in a single chip," but denied that it was designed to provide direct competition for the likes of Qualcomm and Nvidia. "As Huawei does not sell chips directly to third party companies, if you're talking about pure chip-vendors, there is never competition between Huawei and them," Xu explained at the Huawei Connect conference in the Shanghai World Expo Exhibition and Convention Center. "We provide hardware and cloud services so if it's a hardware company or a cloud service company, there is competition here."
Huawei has unveiled its new smart cities digital platform utilising artificial intelligence (AI) and Internet of Things (IoT) capabilities, which it said could be used across smart public safety, environmental protection, transportation, government, education, and agriculture. Huawei's AI Digital Platform connects what it calls the brain, or command centre; the central nervous system, or network; and the peripheral nervous system, made up of sensors across a city. "Just like an operating system, the platform is compatible with different city sensors, creates a city digital twin, and supports diverse city applications," Huawei Enterprise Business Group VP Ma Yue said. The smart cities digital platform combines AI, IoT, big data, a geographic information system, video, cloud, converged communications, and security. "Huawei has also developed a middleware platform to provide services to software application partners. This is designed to help application partners quickly develop upper-layer applications to accelerate transformation and innovation in city management, city services, and industry development," the Chinese networking giant added.